RF Transistor clamping device for the TO270WB plastic packages such as the MRF6V2150N, MRF6V2300N, and MRFE6VP5300N.
Made from high temperature glassfibre-reinforced Celstran Polyamide 66.
Manufactured in accordance with NXP document AN3789, the device has a slight curve on the bottom edge to ensure even clamping force across the underside of the transistor.
Size 28 (L) x 9 (W) x 7 (H)mm.
Hole centres 21mm