RF Transistor Clamping Device for TO270WB Packages

to270wb
RF Transistor clamping device for the TO270WB plastic packages such as the MRF6V2150N, MRF6V2300N, and MRFE6VP5300N.  Made from high temperature glassfibre-reinforced Celstran Polyamide 66.  Manufactured in accordance with NXP document AN3789, the device has a slight curve on the bottom edge to ...Read more
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RF Transistor clamping device for the TO270WB plastic packages such as the MRF6V2150N, MRF6V2300N, and MRFE6VP5300N. 

Made from high temperature glassfibre-reinforced Celstran Polyamide 66. 

Manufactured in accordance with NXP document AN3789, the device has a slight curve on the bottom edge to ensure even clamping force across the underside of the transistor. 

Size 28 (L) x 9 (W) x 7 (H)mm. 

Hole centres 21mm

Sold singly. 

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